• Manufacturer: MACOM Technology Solutions
• Operating Temperature: -55°C ~ 85°C
• Package / Case: 20-LQFN Exposed Pad
• Supplier Device Package: 20-HQFN (9x9)
• Impedance: 50Ohm
• Voltage - Supply: 100V
• Frequency Range: 50MHz ~ 1GHz
• Insertion Loss: 0.5dB
• Circuit: SP3T
• Test Frequency: 1GHz
• Isolation: -40dB

• Manufacturer: MACOM Technology Solutions
• Series: HMIC™
• Operating Temperature: -65°C ~ 125°C
• Impedance: 50Ohm
• Frequency Range: 50MHz ~ 20GHz
• Insertion Loss: 1.2dB
• Circuit: SP3T
• RF Type: General Purpose
• Topology: Reflective
• Test Frequency: 20GHz
• Isolation: -31dB

• Manufacturer: MACOM Technology Solutions
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-PDFN (2x2)
• Impedance: 50Ohm
• Frequency Range: DC ~ 3.5GHz
• Insertion Loss: 0.6dB
• Circuit: SP3T
• RF Type: Bluetooth, WLAN
• Topology: Reflective
• P1dB: 36dBm
• Test Frequency: 2.45GHz
• Isolation: 20dB

• Manufacturer: MACOM Technology Solutions
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SOIC
• Impedance: 50Ohm
• Voltage - Supply: 4.5V ~ 5.5V
• Frequency Range: 0Hz ~ 3GHz
• Insertion Loss: 2dB
• Circuit: SP3T
• RF Type: General Purpose
• Topology: Absorptive
• P1dB: 27dBm
• Test Frequency: 3GHz
• IIP3: 46dBm
• Isolation: 32dB

• Manufacturer: MACOM Technology Solutions
• Series: HMIC™
• Operating Temperature: -65°C ~ 125°C
• Package / Case: Die
• Supplier Device Package: Chip
• Voltage - Supply: 50V
• Frequency Range: 50MHz ~ 20GHz
• Insertion Loss: 0.9dB
• Circuit: SP3T
• RF Type: General Purpose
• Test Frequency: 20GHz
• Isolation: 42dB