|
B39321R2704U310
|
SAW RES 315.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39871R2711U310
|
SAW RES 868.3500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
868.35MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 125°C |
50 Ohms |
|
|
B39871 |
|
B39431R850H210
|
SAW RES 433.9400MHZ 2.7PF SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.94MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
Built in Capacitor |
0.197" L x 0.138" W (5.00mm x 3.50mm) |
2.7pF |
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39122R0959H110
|
SAW RES 1.1760GHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
1.176GHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-40°C ~ 125°C |
50 Ohms |
±50ppm |
|
R959 |
|
B39431R0900U410
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.043" (1.09mm) |
-40°C ~ 125°C |
50 Ohms |
|
±75kHz |
B39431 |
|
B39431R0860H210
|
SAW RESONATOR SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
|
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
|
|
|
|
B39431 |
|
B39431R0904U410
|
SAW RES 433.4200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.42MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.043" (1.09mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39321R0903H110
|
SAW RES 315.5000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315.5MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39311R854H210
|
SAW RES 314.5000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
314.5MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39311 |
|
B39321R1921A310
|
SAW RES 315.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-45°C ~ 125°C |
50 Ohms |
±50ppm |
|
R1921 |
|
B39321R901U410
|
SAW RES 315.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
Without Capacitor |
0.118" L x 0.118" W (3.00mm x 3.00mm) |
3.3pF |
0.043" (1.09mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39871R804H210
|
SAW RES 868.3500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
868.35MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39871 |
|
B39431R0980U410
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.043" (1.09mm) |
-45°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39431R0970H110
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
±50ppm |
|
B39431 |
|
B39431R1903A310
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-45°C ~ 125°C |
26 Ohms |
|
|
R1900 |