• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Серия
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Списком Таблицей
Найдено: 21952
Наименование Описание Производитель
Тип
Вид монтажа
Features
Коннектор
Рабочая температура
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Серия
28-3518-11 CONN IC DIP SOCKET 28POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass 518
20-3513-11H CONN IC DIP SOCKET 20POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Closed Frame Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Lo-PRO®file, 513
44-6574-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Through Hole Closed Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper 57
523-13-100-13-062003 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Wire Wrap Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 100 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 0.100" (2.54mm) 10.0µin (0.25µm) 523
121-13-310-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 121
510-93-153-15-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 153 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 510
511-93-156-15-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 156 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
116-43-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
605-91-308-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 605
116-93-316-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
116-47-310-41-006000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10 (2 x 5) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 116
214-99-308-01-670800 CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Surface Mount Closed Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 214
115-87-424-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 24 (2 x 12) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) Brass 115
APA-324-T-M ADAPTER PLUG Samtec Inc. Through Hole Open Frame Solder Polybutylene Terephthalate (PBT), Glass Filled 24 (2 x 12) 0.100" (2.54mm) Tin Tin Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze APA
1-1814642-0 CONN IC DIP SOCKET 10POS TIN TE Connectivity AMP Connectors DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Thermoplastic, Polyester 10 (2 x 5) 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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