• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Серия
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Списком Таблицей
Найдено: 21952
Наименование Описание Производитель
Тип
Вид монтажа
Features
Коннектор
Рабочая температура
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Серия
27-0508-21 CONN SOCKET SIP 27POS GOLD Aries Electronics SIP Through Hole Wire Wrap -55°C ~ 125°C Polyamide (PA46), Nylon 4/6 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 10.0µin (0.25µm) Brass 508
38-1518-00 CONN IC DIP SOCKET 38POS GOLD Aries Electronics DIP, 0.2" (5.08mm) Row Spacing Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass 518
26-7XXXX-10 CONN SOCKET SIP 26POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
10-4513-11H CONN IC DIP SOCKET 10POS GOLD Aries Electronics DIP, 0.4" (10.16mm) Row Spacing Through Hole Closed Frame Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Lo-PRO®file, 513
522-93-097-11-041002 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 97 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 522
114-47-428-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Surface Mount Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 28 (2 x 14) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 114
126-91-428-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 126
346-93-150-41-013000 CONN SOCKET SIP 50POS GOLD Mill-Max Manufacturing Corp. SIP Through Hole Press-Fit -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 50 (1 x 50) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 346
116-43-320-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
116-41-652-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 116
146-93-306-41-013000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Press-Fit -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 146
110-43-632-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
299-87-316-10-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip DIP, 0.3" (7.62mm) Row Spacing Through Hole, Right Angle, Horizontal Closed Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 16 (2 x 8) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) Brass 299
1-1825376-2 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors DIP, 0.6" (15.24mm) Row Spacing Through Hole Closed Frame Solder -55°C ~ 125°C Thermoplastic, Glass Filled 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper Diplomate DL
8059-2G3 CONN SOCKET TRANSIST TO-5 4POS TE Connectivity AMP Connectors Transistor, TO-5 Through Hole Closed Frame Solder -55°C ~ 125°C Polyamide (PA), Nylon, Glass Filled 4 (Round) Gold Gold Beryllium Copper Brass 8059
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