• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Серия
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Списком Таблицей
Найдено: 21952
Наименование Описание Производитель
Тип
Вид монтажа
Features
Коннектор
Рабочая температура
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Серия
4818-3004-CP CONN IC DIP SOCKET 18POS TIN 3M DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Solder -25°C ~ 85°C Polyester, Glass Filled 18 (2 x 9) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Tin Phosphor Bronze 0.100" (2.54mm) 35.0µin (0.90µm) Phosphor Bronze 4800
31-0508-30 CONN SOCKET SIP 31POS GOLD Aries Electronics SIP Through Hole Wire Wrap -55°C ~ 105°C Polyamide (PA46), Nylon 4/6 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 10.0µin (0.25µm) Brass 508
27-7580-10 CONN SOCKET SIP 27POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
07-0518-10H CONN SOCKET SIP 7POS GOLD Aries Electronics SIP Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass 518
06-7755-10 CONN SOCKET SIP 6POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
04-0517-90C CONN SOCKET SIP 4POS GOLD Aries Electronics SIP Through Hole, Right Angle Solder Polyamide (PA46), Nylon 4/6, Glass Filled 4 (1 x 4) Gold 30.0µin (0.76µm) Tin Beryllium Copper 200.0µin (5.08µm) Brass 0517
510-93-145-15-002001 CONN SOCKET PGA 145POS GOLD Mill-Max Manufacturing Corp. PGA Through Hole Closed Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Brass Alloy 510
115-91-428-41-001000 SKT IC OPEN LOWPRO Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 115
116-91-422-41-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 116
515-93-145-15-002001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
510-93-088-13-081001 PGA SOCK 88PIN 13X13 SOLDER TL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 88 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Brass Alloy 510
317-43-102-41-005000 CONN SKT STRIP Mill-Max Manufacturing Corp. SIP Through Hole Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 2 (1 x 2) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy 317
115-44-422-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 115
XR2D-4001-N CONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div DIP, 0.6" (15.24mm) Row Spacing Through Hole Carrier Solder -55°C ~ 125°C Polybutylene Terephthalate (PBT), Glass Filled 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold Beryllium Copper 0.100" (2.54mm) 29.5µin (0.75µm) Beryllium Copper XR2
8058-1G23 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors Transistor, TO-5 Through Hole Closed Frame Solder -55°C ~ 125°C Polytetrafluoroethylene (PTFE) 3 (Round) Gold Gold Beryllium Copper Brass 8058
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