• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Серия
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Списком Таблицей
Найдено: 21952
Наименование Описание Производитель
Тип
Вид монтажа
Features
Коннектор
Рабочая температура
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Серия
SIP1X14-011BLF CONN SOCKET SIP 14POS GOLD Amphenol ICC (FCI) SIP Through Hole Closed Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass SIP1x
14-810-90 CONN IC DIP SOCKET 14POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole, Right Angle, Vertical Closed Frame Solder Polyamide (PA46), Nylon 4/6 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze Vertisockets™ 800
08-3501-20 CONN IC DIP SOCKET 8POS TIN Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Closed Frame Wire Wrap -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 501
26-0501-30 CONN SOCKET SIP 26POS TIN Aries Electronics SIP Through Hole Wire Wrap -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 501
48-3551-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Through Hole Closed Frame Solder -55°C ~ 250°C Polyetheretherketone (PEEK), Glass Filled 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron Beryllium Nickel 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Nickel 55
510-13-068-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 68 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 510
110-93-422-41-801000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame, Decoupling Capacitor Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 110
511-93-097-11-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 97 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
515-93-092-11-041003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 92 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
110-43-642-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
511-13-073-11-042002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 73 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 511
110-44-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
515-13-085-11-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 85 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 515
XR2P1041 CONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div SIP Threaded Solder -55°C ~ 125°C Polybutylene Terephthalate (PBT), Glass Filled 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass XR2
558-10-400M20-000104 BGA SURFACE MOUNT 1.27MM Preci-Dip BGA Surface Mount Closed Frame Solder -55°C ~ 125°C FR4 Epoxy Glass 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass 558
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