Найдено: 1080756
Наименование Описание Производитель
Тип
Тип аксессуара
Применим к
Connector Type
Цвет
Исполнение
Кол-во позиций
Вид монтажа
Features
Материал
Convert From (Adapter End)
Convert To (Adapter End)
Contact Type
Шаг
Number of Rows
Номинальный ток
Pin or Socket
Wire Gauge
Contact Termination
Покрытие контактов
Contact Finish Thickness
Коннектор
Рабочая температура
Row Spacing
Материал контактов
Номинально напряжение
Fastening Type
Number of Positions Loaded
Степень защиты
Pitch - Mating
Number of Contacts
Material Flammability Rating
Contact Finish - Mating
Row Spacing - Mating
Contact Finish Thickness - Mating
Insulation Color
Высота над платой
Cable Termination
Mated Stacking Heights
Insulation Height
Contact Length - Post
Shrouding
Contact Finish - Post
Length - Overall Pin
Length - Post (Mating)
Length - Stack Height
Contact Length - Mating
Cable Pitch
Board-Side Pitch
Wire Type
Overall Contact Length
Contact Shape
Length - Tail
Contact Finish - Post (Mating)
Contact Finish Thickness - Post (Mating)
Insulation Material
Серия
DF17(2.0)-100DP-0.5V(57) CONN HDR 100POS SMD GOLD Hirose Electric Co Ltd Header, Outer Shroud Contacts 100 Surface Mount Board Guide, Solder Retention 0.020" (0.50mm) 2 Gold 0.169" (4.30mm) 5mm, 6mm DF17
1723104302 ULTRAFIT HDR RT 1R NAT 02 30AU Molex Header Board to Cable/Wire 2 Through Hole, Right Angle Board Guide, Glow Wire Compliant Male Pin 1 Varies by Wire Gauge Solder -40°C ~ 105°C Copper Alloy 600VAC/DC Latch Holder All 0.138" (3.50mm) UL94 V-0 Gold 3.00µin (0.076µm) Natural 0.534" (13.56mm) 0.126" (3.20mm) Shrouded - 4 Wall Tin Square Liquid Crystal Polymer (LCP) Ultra-Fit 172310
TMM-123-01-L-S-RE 2MM TERMINAL STRIP Samtec Inc. Header Board to Board or Cable 23 Through Hole, Right Angle Male Pin 1 3.2A per Contact Solder -55°C ~ 125°C Phosphor Bronze Push-Pull All 0.079" (2.00mm) Gold 10.0µin (0.25µm) Black 0.079" (2.00mm) 0.120" (3.05mm) Unshrouded Tin 0.126" (3.20mm) Square Liquid Crystal Polymer (LCP) TMM
TMS-112-01-G-S-012 .050" (1.27MM) MICRO HEADER Samtec Inc. Header Board to Board 12 Through Hole Male Pin 1 5A per Contact Solder -55°C ~ 125°C Phosphor Bronze Push-Pull 11 0.050" (1.27mm) UL94 V-0 Gold 10.0µin (0.25µm) Black 0.100" (2.54mm) 0.120" (3.05mm) Unshrouded Gold 0.230" (5.84mm) 0.450" (11.43mm) Square Liquid Crystal Polymer (LCP) TMS
TSM-102-02-H-DH CONN HEADER SMD R/A 4POS 2.54MM Samtec Inc. Header Board to Board or Cable 4 Surface Mount, Right Angle Male Pin 2 Solder -55°C ~ 125°C Phosphor Bronze Push-Pull All 0.100" (2.54mm) UL94 V-0 Gold 0.100" (2.54mm) 30.0µin (0.76µm) Black 0.240" (6.10mm) Unshrouded Gold 0.320" (8.13mm) Square Liquid Crystal Polymer (LCP) TSM
HMTSW-107-06-F-D-060 CONN HEADER VERT 14POS 2.54MM Samtec Inc. Header Board to Board or Cable 14 Through Hole Male Pin 2 3A Solder -55°C ~ 125°C Phosphor Bronze Push-Pull All 0.100" (2.54mm) UL94 V-0 Gold 0.100" (2.54mm) 3.00µin (0.076µm) Natural 0.100" (2.54mm) 0.140" (3.56mm) Unshrouded Tin 0.060" (1.52mm) 0.300" (7.62mm) Square Liquid Crystal Polymer (LCP) Flex Stack, HMTSW
FTR-130-02-S-D-A-P-TR CONN HEADER SMD 60POS 1.27MM Samtec Inc. Header Board to Board 60 Surface Mount Board Guide, Pick and Place Male Pin 2 3.1A per Contact Solder -55°C ~ 125°C Phosphor Bronze Push-Pull All 0.050" (1.27mm) UL94 V-0 Gold 0.100" (2.54mm) 30.0µin (0.76µm) Black 0.100" (2.54mm) Unshrouded Tin 0.100" (2.54mm) Square Liquid Crystal Polymer (LCP) FTR
HDWM-15-58-S-D-250 CONN HDR 30POS 0.05 STACK T/H Samtec Inc. Black 30 Through Hole 0.050" (1.27mm) 2 Solder 0.100" (2.54mm) 0.705" (17.907mm) 0.335" (8.509mm) 0.250" (6.350mm) 0.120" (3.048mm) Gold 30.0µin (0.76µm) Flex Stack, HDWM
DW-04-07-T-S-200 CONN HDR 4POS 0.1 STACK T/H TIN Samtec Inc. Black 4 Through Hole 0.100" (2.54mm) 1 Solder 0.430" (10.922mm) 0.120" (3.048mm) 0.200" (5.080mm) 0.110" (2.794mm) Tin Flex Stack, DW
ZW-15-09-G-D-330-150 CONN BRD STACK .100" 30POS Samtec Inc.
FW-26-02-F-D-300-100 CONN HDR 52POS 0.05 STACK T/H Samtec Inc. Black 52 Through Hole 0.050" (1.27mm) 2 Solder 0.050" (1.27mm) 0.475" (12.065mm) 0.100" (2.540mm) 0.300" (7.620mm) 0.075" (1.905mm) Gold 3.00µin (0.076µm) Flex Stack, FW
ESQT-131-02-F-D-715 CONN SOCKET 62POS 0.079 GOLD PCB Samtec Inc. Elevated Socket Board to Board or Cable 62 Through Hole Forked 2 4.5A per Contact Solder -55°C ~ 125°C Push-Pull All 0.079" (2.00mm) UL94 V-0 Gold 0.079" (2.00mm) 3.00µin (0.076µm) Black 0.715" (18.16mm) 0.135" (3.43mm) Tin ESQT
ESQT-106-02-F-D-713 CONN SOCKET 12POS 0.079 GOLD PCB Samtec Inc. Elevated Socket Board to Board or Cable 12 Through Hole Forked 2 4.5A per Contact Solder -55°C ~ 125°C Push-Pull All 0.079" (2.00mm) UL94 V-0 Gold 0.079" (2.00mm) 3.00µin (0.076µm) Black 0.713" (18.10mm) 0.137" (3.48mm) Tin ESQT
MOLC-107-31-SM-Q CONN HEADER VERT 28POS 1.27MM Samtec Inc. Header Board to Board 28 Through Hole Male Pin 4 2.6A per Contact Solder -55°C ~ 125°C Phosphor Bronze Push-Pull All 0.050" (1.27mm) UL94 V-0 Gold 0.050" (1.27mm) 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.075" (1.91mm) Shrouded - 4 Wall Tin 0.144" (3.66mm) Square Liquid Crystal Polymer (LCP) FOURRAY™ MOLC
ERM5-010-04.0-L-DV-TR CONN HDR 20POS SMD GOLD Samtec Inc. Header, Outer Shroud Contacts 20 Surface Mount Board Guide 0.020" (0.50mm) 2 Gold 10.0µin (0.25µm) 0.270" (6.85mm) 9mm, 11mm Edge Rate™ ERM5